Object-Oriented Thermal Placement using an Accurate Heat Model

An MCM's increased throughput and dense circuitry can easily result in failure if the board contains \hot spots". Therefore, an accurate thermal model of an MCM was needed in the development of a new placement algorithm designed to consider both total net length and heat constraints. This algorithm uses a combination of simulated evolution and simulated annealing in an iterative approach. The tness method evaluates the maximum heat for each chip, considering the chip's own heat and the heat from surrounding chips at its hottest point. Results are shown and comparisons are drawn to other placement algorithms.